The overall objective of this work package is to develop essential semiconductor solutions on component level enabling EdgeAI-trust’s technologies that are implemented in the supply chains. This is based on the requirements and specifications that are defined in WP1 and in accordance with the system design development in WP2. The focus will be on Smart sensors and embedded control devices that will be integrated, e.g., by the EdgeAI-trust’s manufacturing, agriculture or the automated vehicles demonstrators. For that purpose, the objectives of this work package are directed in particular towards the following items: